Heat Sink Compound Manufacturer in India
A heat sink compound is a passive heat exchanges that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature at optimal levels.
In computers, heat sinks are used to cool central processing units or graphics processors.Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LED's), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit.
Heat sink compound, which is also called heat sink paste, is designed to efficiently transfer heat away from a heat generating component. For electrical applications, heat sink compound is used to thermally bond a component with a mechanical heat sink. The compound fills the gap between the CPU (central processing unit) or other heat generating components.
In addition, heat sink paste is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required. Although heat sink paste does not have the thermal conductivity of metals like copper and silver, the improvement over the air will increase thermal responsiveness.
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